Silicon wafer with microchips fixed in a holder with a steel frame after the dicing process and separate microchips. Silicon Color silicon wafers with glare.

CHiPPS is employing a holistic approach to patterning science that incorporates knowledge of radiation-driven reactions at extreme ultraviolet (EUV) photon energies to design new materials that are highly sensitive, highly uniform in structure and chemical response, and with controllable interfacial interactions during pattern development. 

Recent Publications

Logos from participating locations including Berkeley Lab, Stanford University, Cornell University, Argonne National Laboratory, UC Santa Barbara, San Jose State University

As an Energy Frontier Research Center (EFRC) funded by the U.S. Department of Energy, CHiPPS is led by Berkeley Lab and is a large collaborative effort of scientists at six participating institutions.